• Integrated packaging approach with 3-D integration of structured LTCC for high density packaging in conjunction with environmental and mechanical protection of the devices. Customized packaging of microsensors using reverse dam-and-fill and advanced ceramic techniques. Packaging of devices incorporating staggered via-based systems for efficient heat removal and thermal management with better power dissipation capability.
  • LTCC micro-hotplates and thick-film heaters for realizing specific heating applications, advanced interconnections and isothermal solidification, thick-film electrodes and other components.
  • Exploration of smart materials and structures on LTCC and ceramic platform; IR emitter, gas detector and acceleration sensor; characterization and reliability analysis; capability creation for oil-filled and hermetic/ vacuum sealing of devices.