• Microsystem Packaging Group is involved in conceptualizing design strategy and developing advanced techniques for packaging of microsystems. Packaging for a reliable microsystem module includes integration of devices and sensors with unique packaging for each type of sensor. The capabilities being developed are: low-temperature-cofired ceramic (LTCC) based integrated packaging approach, customized packaging and advanced materials.
  • The Group is also actively involved in the design and fabrication of thick-film alumina and LTCC based electrodes, application-specific hotplates and microcircuits.

Research Areas

  • Integrated packaging approach with 3-D integration of structured LTCC for high density packaging in conjunction with environmental and mechanical protection of the devices. Customized packaging of microsensors using reverse dam-and-fill and advanced ceramic techniques. Packaging of devices incorporating staggered via-based systems for efficient heat removal and thermal management with better power dissipation capability.
  • LTCC micro-hotplates and thick-film heaters for realizing specific heating applications, advanced interconnections and isothermal solidification, thick-film electrodes and other components.
  • Exploration of smart materials and structures on LTCC and ceramic platform; IR emitter, gas detector and acceleration sensor; characterization and reliability analysis; capability creation for oil-filled and hermetic/ vacuum sealing of devices.


Packaging requirements for microsystems is very important and crucial to realize its optimal performance. Often these packages are custom-made. The group provides such solutions for microsystems. The group is also involved in developing thick-film electrodes and hotplates for specific applications.