• Microsystem Packaging Group is involved in conceptualizing design strategy and developing advanced techniques for packaging of microsystems. Packaging for a reliable microsystem module includes integration of devices and sensors with unique packaging for each type of sensor. The capabilities being developed are: low-temperature-cofired ceramic (LTCC) based integrated packaging approach, customized packaging and advanced materials
  • The Group is also actively involved in the design and fabrication of thick-film alumina and LTCC based electrodes, application-specific hotplates and microcircuits.