MEMS Micromirror devices find numerous applications in the field of projection displays, adaptive optics, MEMS scanners, multi-object spectroscopy, optical switches, coherence tomography and projection lithography. Most of these devices are used for angular deflection of light by torsional deflection of micromirror or axial modulation of light by piston motion of micromirror. Motions in both cases is [...]

Diamond detectors are most suitable for high energy radiation detection in the harsh environment with improved accuracy. Due to inert nature of the diamond material, the technology needs proper optimisation for metal film adhesion and further bonding and packaging. Synthetic diamond material technology is commercially available around Chemical Vapour Deposition (CVD) to get the poly crystal [...]

Simulation and optimization of single junction a-Si:H solar cell, and for a-Si:H/c-Si tandem solar cells was carried out. Micro-texturing and anti–reflection coating, ARC (silicon nitride) deposition on silicon wafers by PECVD has been performed to reduce the reflection (~7%) from top surface of silicon wafers.ARC (silicon nitride) deposition on 156mm x 156 mm c-silicon wafers has [...]

MEMS pressure sensors for low and highpressure applications with operation at elevated temperatures (100 – 200 ° C) have been aimed in this project. CSIR-CEERI has expertise in LPCVD polysilicon based MEMS sensor with a square diaphragm of 2 mm sides and thickness in a range of 50 – 100 micrometers. The sensing layer of polysilicon [...]

Packaging of ISFET microsensors was completed using LTCC technology. LTCC substrate with required dimensions was fabricated and screen printing of conductor paste was done as per the mask layout. LTCC frame and lid was also developed for protection of ISFET device. Die bonding and wire bonding of ISFET device were done. Dam & fill technique was [...]

Design and development of ceramic headers for packaging of 1-axis accelerometer devices were completed (Fig. 1). The overall size of the package was 18 mm x 20 mm. Pd-Ag screen printing was done for die bonding pad, tracks for electrical interconnects and pads for lead attachment. Au screen printing was done for wire bonding pads. Fig. [...]

The packaging of 1-axis accelerometer devices to make functional in 3-axis was explored. Package for 3-axis packaging was designed and developed using thick film alumina technology (Fig. 1). The overall size of the developed ceramic base was 1” x 1”. Pd-Ag screen printing was done for die bonding pad, tracks for electrical interconnects and pads for [...]

The packaging process for InGaNbased biosensors was explored. A base for packaging of the biosensors was developed using thick film alumina technology. Pd-Ag screen printing was done for die bonding pad, tracks for electrical interconnects and pads for lead attachment. Au screen printing was done for wire bonding pads. A lead attachment was done using reflow [...]

The objective of the activity was to design and develop an indigenous system-on-chip (SOC) processor towards the miniaturisation of autopilot hardware of Micro Aerial Vehicle for CSIR-NAL with the goal of achieving reduced weight and power consumption. The development of the SOC is based on available open-source IP cores and is to be fabricated through Multi-Project [...]

Die bonding and wire bonding of circuit for MEMS devices was completed (Fig. 1) and handed over to a user group within the institute. Fig. 1: Die bonding and wire bonding of circuit for MEMS devices Die bonding and wire bonding of SiC Schottky barrier diode, SiC high purity semi-insulating bulk detectors and GaN (High-electron-mobility transistor [...]