Design and development of ceramic headers for packaging of 1-axis accelerometer devices were completed (Fig. 1). The overall size of the package was 18 mm x 20 mm. Pd-Ag screen printing was done for die bonding pad, tracks for electrical interconnects and pads for lead attachment. Au screen printing was done for wire bonding pads.
Fig. 1: Ceramic headers for packaging of 1-axis accelerometer device