The packaging process for InGaNbased biosensors was explored. A base for packaging of the biosensors was developed using thick film alumina technology. Pd-Ag screen printing was done for die bonding pad, tracks for electrical interconnects and pads for lead attachment. Au screen printing was done for wire bonding pads. A lead attachment was done using reflow soldering process. Die bonding and wire bonding of the device was done and experiments for encapsulation of the device while exposing the sensing area has been under the process.
Fig. 1: Die bonding and wire bonding of InGaN-based biosensor on a printed alumina substrate