ODG1-Lapping and Polishing

Manufacturer: Engis Corporation Ltd., USA
MFD: 2009-03-01
Model: N/A
Specs: Lapping Machine is capable to thinning and polishing of sapphire wafer. Diamond slurry used for thinning the wafer.
Charges: For Industry - 10,000/- INR Per Sample
For Student - 5,000/- INR Per Sample
*These are standard charges. Actual charges may vary as per job requirement.
Contacts: N/A