ODG1-Lapping and Polishing
Manufacturer: Engis Corporation Ltd., USAMFD: 2009-03-01Model: N/ASpecs: Lapping Machine is capable to thinning and polishing of sapphire wafer. Diamond slurry used for thinning the wafer.Charges: For Industry - 10,000/- INR Per Sample
For Student - 5,000/- INR Per Sample
*These are standard charges. Actual charges may vary as per job requirement.Contacts: N/A