BS4-Wire Bond

Manufacturer: West Bond,USA
MFD:
Model: N/A
Specs: Ball to wedge gold wire bonding. Specifically for MEMS device packaging.
Charges: For Industry - 1200 /- INR Per Sample
For Student - 600 /- INR Per Sample
*These are standard charges. Actual charges may vary as per job requirement.
Contacts: N/A