BS2-Die-Bonder

Manufacturer: Tresky
MFD: 2015-05-01
Model: N/A
Specs: Die bonder system for chip attachment (typical planar device size≥ 2mm x 2 mm)
Charges: For Industry - 550 /- INR Per Sample
For Student - 275 /- INR Per Sample
*These are standard charges. Actual charges may vary as per job requirement.
Contacts: N/A