BS1-Align Bonder

Manufacturer: EVG
MFD: 2005-01-01
Model: N/A
Specs: System is useful for glass to silicon wafer Bonding. Maximum wafers size: 6”
Charges: For Industry - 550 /- INR Per Sample
For Student - 275 /- INR Per Sample
*These are standard charges. Actual charges may vary as per job requirement.
Contacts: N/A