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Dr. Dheeraj Kumar Kharbanda received the Ph.D. degree under the faculty of Engineering Sciences from Academy of Scientific and Innovative Research (AcSIR) in 2020. He is currently working as Senior Scientist in the Microsystem Packaging Group at CSIR-CEERI. He has worked on LTCC/alumina based hotplates; thick-film sensor electrodes; customized packaging of microsensors using LTCC technology; thick film alumina based packaging. His current research interests are in design & development of LTCC/thick-film based devices & sensor. He has 18 publications in journals and conferences.