Technologies/IPs

Home/Technologies/IPs
19 05, 2017

GaN/InGaN based Blue LEDs and Solar cells

May 19th, 2017|

Under CSIR-TAPSUN programme, an improved design by incorporating ITO/ graphene as current spreading layers was carried out forenhancement of light extraction. LED epilayer structures having 9 and 10 QWs with or without strain-releasing superlattice (SL) structures weregrown on the single side polished (SSP), double side polished (DSP) and patterned sapphire substrates (PSS) by MOCVD and characterised.Preliminary [...]

19 05, 2017

Fabrication of SWCNT Based Flexible Chemiresistor

May 19th, 2017|

Carbon Nanotubes (CNT) based chemiresistors are one of the fundamental building blocks of the advanced nanosensors for applications in gas sensing and biosensing. Low-temperature fabrication process allows to develop large area flexible sensors for different applications such as environment pollution monitoring, gas leakage, food quality, smart textile, biosensing etc. These sensors are flexible, lightweight and affordable [...]

19 05, 2017

RF MEMS Switches

May 19th, 2017|

RF MEMS devices developed at CSIR CEERI have shown great potential in strategic, mobile and medical applications. The compact, lightweight (micrograms) and highly energy efficient devices can be used in earth-bound communication stations (in Satellite Payloads), hand-held communication systems, missile communication or smart munition (in RF front ends for communication), medical diagnostics (in MRIs for Digital [...]

19 05, 2017

MEMS Micromirror Devices for Optical Applications

May 19th, 2017|

MEMS Micromirror devices find numerous applications in the field of projection displays, adaptive optics, MEMS scanners, multi-object spectroscopy, optical switches, coherence tomography and projection lithography. Most of these devices are used for angular deflection of light by torsional deflection of micromirror or axial modulation of light by piston motion of micromirror. Motions in both cases is [...]

19 05, 2017

Diamond Detectors

May 19th, 2017|

Diamond detectors are most suitable for high energy radiation detection in the harsh environment with improved accuracy. Due to inert nature of the diamond material, the technology needs proper optimisation for metal film adhesion and further bonding and packaging. Synthetic diamond material technology is commercially available around Chemical Vapour Deposition (CVD) to get the poly crystal [...]

19 05, 2017

Silicon Tandem Solar Cell under Advanced Materials for Next- generation Energy Efficient Devices (D-NEED)

May 19th, 2017|

Simulation and optimization of single junction a-Si:H solar cell, and for a-Si:H/c-Si tandem solar cells was carried out. Micro-texturing and anti–reflection coating, ARC (silicon nitride) deposition on silicon wafers by PECVD has been performed to reduce the reflection (~7%) from top surface of silicon wafers.ARC (silicon nitride) deposition on 156mm x 156 mm c-silicon wafers has [...]

19 05, 2017

MEMS Technology Based Sensors for Low and High Pressure Sensors

May 19th, 2017|

MEMS pressure sensors for low and highpressure applications with operation at elevated temperatures (100 – 200 ° C) have been aimed in this project. CSIR-CEERI has expertise in LPCVD polysilicon based MEMS sensor with a square diaphragm of 2 mm sides and thickness in a range of 50 – 100 micrometers. The sensing layer of polysilicon [...]

19 05, 2017

Packaging of ISFET Microsensor (ver. 2)

May 19th, 2017|

Packaging of ISFET microsensors was completed using LTCC technology. LTCC substrate with required dimensions was fabricated and screen printing of conductor paste was done as per the mask layout. LTCC frame and lid was also developed for protection of ISFET device. Die bonding and wire bonding of ISFET device were done. Dam & fill technique was [...]

19 05, 2017

Ceramic Headers for Packaging of 1-axis Accelerometer

May 19th, 2017|

Design and development of ceramic headers for packaging of 1-axis accelerometer devices were completed (Fig. 1). The overall size of the package was 18 mm x 20 mm. Pd-Ag screen printing was done for die bonding pad, tracks for electrical interconnects and pads for lead attachment. Au screen printing was done for wire bonding pads. Fig. [...]

19 05, 2017

3-axis Package for Accelerometer

May 19th, 2017|

The packaging of 1-axis accelerometer devices to make functional in 3-axis was explored. Package for 3-axis packaging was designed and developed using thick film alumina technology (Fig. 1). The overall size of the developed ceramic base was 1” x 1”. Pd-Ag screen printing was done for die bonding pad, tracks for electrical interconnects and pads for [...]