Job Cards
Cyber Physical System: Job Cards
Smart Sensors: Job Cards
Fabrication Equipments
- AS1-Plasma Asher MEMS
- AS2-Plasma Asher SNTG
- AS3-Plasma Cleaner
- BS1-Align Bonder(MEMS)
- BS2-Die-Bonder(HMG)
- BS3-Wire Bond(HMG)
- BS4-Wire Bond(MEMS)
- BS5-Wire Bond(ODG)
- DS1-Dicing Machine (DFD 6450)
- DS2-Dicing Machine (DAD 321)
- DS3-Laser Dicing Machine
- ES1- Reactive Ion Etching (RIE-Annelva)
- ES2-Deep Reactive Ion Etching (DRIE)
- ES3-Reactive Ion Etching (RIE-Nitride)
- ES4-Reactive Ion Etching (RIE-STS)
- EVS1-Electron Beam Evaporation -VST-ODG
- EVS2-Electron Beam Evaporation -Varian (ODG)
- EVS3-Electron Beam Evaporation(SNTG)
- FMPG001-Atomic Force Microscope & Raman Spectroscopy
- SDS1-Al Sputtering System (MEMS)
- SDS2-Reactive Co-Sputtering System (MEMS)
- SDS3-Reactive Co-Sputtering System (SNTG)
- SDS4-RF Magnetron Sputtering System
- SDS5-Sputtering System
- SDS6-ZnO Sputtering System
- SDS7-MRC (Sputtering System)
- CD1-PECVD (ODG)
- CD2-PECVD_NB(SNTG)
- CD3-PECVD_MB(SNTG)
- CD4-LPCVD_NB(SNTG)
- CD5-LPCVD (MEMS)
- CD6-APCVD_NB(SNTG)
- CD7-MOCVD(ODG)
- DF1-Oxidation diffusion_NB(SNTG)
- DF2-Oxidation_NB(SNTG)
- DF3-Oxidation diffusion_MB(SNTG)
- DF4-Oxidation diffusion(MEMS)
- MA1-Mask Aligner (ODG)
- MA2-Mask Aligner (SNTG)
- MA3-Mask Aligner (MEMS)
- ODG1-Lapping and Polishing
- ODG2-Rapid Thermal Annealing (RTA)
- ODG3-Laser Lift Off
- SNTG1-Critical Point Drier
- SNTG2-Dip PEN Nanowriter
- SNTG3-MASK Making
- SNTG4-Ion Implantation
- HMG1-Via-Punching system
- HMG2-Via-filler
- HMG3-LTCC Screen Printer
- HMG4-Isostatic Laminator
- HMG5-LTCC Box Furnace
- HMG6-Laser micromachining system
- SDS8_ Sputtering System(Gas Sensor)
Characterization Equipments
- ICDG1-AWG with Logic Analyzer
- ICDG2-DSO with Digitizer
- ICDG3-LCR Meter
- ICDG4-Spectrum Analyzer
- MEMS1- Micro system analyzer MSA-500
- MEMS2-DEKTAK 6M Surface Profiler
- MEMS3-Film Stress Measurement System
- MEMS4-IV-CV Characterization System
- MEMS5-Zeta 3D Profiler
- MEMS6-Acoustic Imager
- ODG1-Photoluminescence Mapping System (PL)
- ODG2-Prism Coupler
- ODG3-Hall Effect Measurement System
- ODG4-Step Height Measurement System
- ODG5-Solar Simulator
- ODG6-Intelligent Test System
- ODG7-Thermal Imaging Microscope
- ODG8-Probe Station with EL Spectra
- ODG9-Helium Leak Detector
- ODG10-LED Characterization System
- ODG11-Atomic Force Microscope
- SNTG1-DC Probe Station
- SNTG2-Scanning Electron Microscope with EDS
- SNTG3-Low level IV/CV Measurement System
- SNTG4-Single Wavelength Ellipsometer
- SNTG5-Four Point Probe
- SNTG6-Vibrating Sample Magnetometer
- SNTG7-Nanospec 6100
- SNTG8-FTIR
Microwave Devices: Job Cards
- MDT01-HT Hydrogen Furnace @1800 C, (Cathode Lab, Room 12B), Mr. Tajender Pratap Singh, 2236
- MDT02-Auger Electron Spectroscopy, (Cathode Lab, Room 12), Mr. Tajender Pratap Singh, 2236
- MDT03-DC Sputter coating system, (Cathode Lab, Room 12A), Mr. Tajender Pratap Singh, 2236
- MDT04-Agilent Vector Network Analyser (VNA) @(10 MHz – 50 GHz), (Klystron Lab, Room 13), Mr. A Nagraju/ Mr. Vikram Rawat, 2232
- MTD05-RF Peak Power Meter, (Klystron Lab, Room 13), Mr. A Nagraju/ Mr. Vikram Rawat, 2232
- MTD06-Agilent Spectrum Analyzer 3 Hz- 50 GHz , (Klystron Lab, Room 13), Mr. A Nagraju/ Mr. Vikram Rawat, 2232
- MTD07-High Voltage Pulse Modulator, (Klystron Lab, Room 13), Mr. A Nagraju/ Mr. Vikram Rawat, 2232
- MTD08-TIG welding Machine, (Klystron Lab, Room 13), Mr. Rakesh Meena, 2258
- MTD09-Wellmake Vertical Retort Hydrogen Furnace, (Klystron Lab, Room 13), Mr. Bijendra Kumar, 2232
- MTD10-HHV Vacuum/H2 Furnace, (NFL), Mr. Bijendra Kumar, 2232
- MTD11-High Voltage Pulse Modulator I 45kV/110A, (Magnetron Lab, Room 18), Mr. N. Kanagaraj, 2382
- MTD12-High Voltage Pulse Modulator II 50 kV/120A, (Magnetron Lab, Room 18), Mr. N. Kanagaraj, 2382
- MTD13-Microwave Generator, 2.45 GHz, 15 KW, (Magnetron Lab, Room 3A), Mr. N. Kanagaraj, 2382
- MTD14-Vector Network Analyser (VNA), 20 KHz-8 GHz, (Magnetron Lab, Room 18), Mr. Prateek Chaudhury, 2382
- MTD15-Spectrum Analyzer, 9 KHz-13.6 GHz, (Magnetron Lab, Room 18), Mr. Prateek Chaudhury, 2382
- MTD16-Pulse Power Supply, (Plasma Lab), Mr. B L Meena, 2430
- MTD17-Capacitor Charging power supply, (Plasma Lab), Mr. B L Meena, 2430
- MTD18- RF Power Supply, (Plasma Lab), Mr. B L Meena, 2430
- MTD19-3 RF/DC Reactive Sputtering System, (Plasma Lab), Mr. B L Meena, 2430
- MTD20-Spectrophotometer, (Plasma Lab), Mr. B L Meena, 2430
- MTD21-Server Machine, (Plasma Lab), Mr. Mahesh Kumar Singh, 2430
- MTD22-Semi-Shielded Anechoic chamber, (Plasma Lab), Mr. Mahesh Kumar Singh, 2430
- MTD23-ICCD Camera, (Plasma Lab), Mr. Mahesh Kumar Singh, 2430
- MTD24-Vacuum Processing Station, (Plasma Lab), Mr. Mahesh Kumar Singh, 2430
- MTD25-Signal Analyzer, (TWT Lab, Room 64), Mr. Pawan Pareek, 2318
- MTD26-Magnetizer, (TWT Lab, Room 64), Mr. Pawan Pareek, 2318
- MTD27-Signal Generator-N5183A, (TWT Lab, Room 64), Mr. Pawan Pareek, 2318
- MTD28-TWT Power Supply, (TWT Lab, Room 64), Mr. Pawan Pareek, 2318
- MTD29- Breakdown Tester (30 KV) , (Assembly Lab), Mr. Pawan Pareek, 2318
- MTD30-Attn Rod Coating System, (TWT Lab, Room No-47), Mr. Pawan Pareek, 2318
- MTD31-Vector Network Analyser (VNA – 220 GHz), (Gyrotron Lab), Dr. Nitin Kumar, 2447
- MTD32-HHV UHV Processing Station (Dia 2mt x Ht 5 mt), (NFL Hall A), Mr. Bijender Kumar /Mr. Narender Singh, 2232
- MTD33-Crane for Processing Station, (NFL Hall A), Mr. Bijender Kumar /Mr. Narender Singh, 2232
- MTD34-LINCOLN TIG welding Machine, (Gyrotron Lab), Mr. Narender Singh, 2447
- MTD35- Beljar hydrogen furnace, (NFL Hall B), Mr. Alok Mishra, 2452
- MTD36-120 KV Breakdown Tester, (Gyrotron Lab), Mr. Alok Mishra, 2452
- MTD37-LASER Welder, (CSF, Room No-48), T P Singh/ Miss Sunita Arya, 2236
- MTD38-Profile projector, (OLd Assembly Lab), Pawan Pareek/ Miss Sunita Arya, 2318
- MTD39-HHV -UHV Processing Station, (NFL Hall B), Mr. Ghyansham Saini, 2225
- MTD40-Varian -UHV Processing Station, (Room No-14), Mr. Ghyansham Saini, 2225
- MTD41- LEPEL Induction heater, (OFL), Mr. Ghyansham Saini, 2225
- MTD42-Helium Leak Detector, (NFL, Hall B), Mr. Mahender Singh/Mr. Ravi, 2634
- MTD43-W-J Muffle furnace 8″ (NFL, Hall B), Mr. Mahender Singh, 2634
- MDT44-HHV-Muffle furnace 8″ (NFL, Hall B), Mr. Mahender Singh, 2634
- MTD45-X-Ray Tomography, (X-Ray Room), Mr. Kulbir Singh, 2634
- MTD46-BOSS Induction heater, (NFL, Hall B), Mr. Kulbir Singh, 2634
- MTD47-Gas Cylinder, Mr. Kulbir Singh, 2634
- MTD48-Therelek 3″Muffle furnace, (NFL, Hall B), Mr. J P Meena, 2356
- MTD49-W-J 5″ Muffle furnace, (OFL), Mr. J P Meena, 2356
- MTD50-W-J 3″ Muffle furnace, (OFL), Mr. J P Meena, 2356
- MTD51-Hydrogen Plant, (CFS), Mr. OP Arya/ Mr. Ravi, 2634
- MTD52-Water Chillers, Mr. Mahendra Singh Soni, 2634
- MTD53-Therelek Vertical Furnace, (OFL), Mr. Mahendra Singh Soni, 2634
- MTD54-W-J Vertical Retort Furnace, (OFL), Mr. Mahendra Singh Soni, 2634
- MTD55-Chemistry, Mr. Rajesh Kumar Meena, 2635
- MTD56-Glass blowing system, Mr. N Jaganathan, 2328
- MTD57-Sand Blasting Unit, (NFL Hall B), Mr. Ghyansham Saini, 2225
Workshop: Job Card
Purchase Section: Job Cards
Gas Cylinder : Job Card
Chemical : Job Card
Job Card Status
Electronics System: Job Cards Status
Semiconductor: Job Cards Status
Fabrication Equipments
- AS1-Plasma Asher MEMS
- AS2-Plasma Asher SNTG
- AS3-Plasma Cleaner
- BS1-Align Bonder(MEMS)
- BS2-Die-Bonder(HMG)
- BS3-Wire Bond(HMG)
- BS4-Wire Bond(MEMS)
- BS5-Wire Bond(ODG)
- DS1-Dicing Machine (DFD 6450)
- DS2-Dicing Machine (DAD 321)
- DS3-Laser Dicing Machine
- ES1- Reactive Ion Etching (RIE-Annelva)
- ES2-Deep Reactive Ion Etching (DRIE)
- ES3-Reactive Ion Etching (RIE-Nitride)
- ES4-Reactive Ion Etching (RIE-STS)
- EVS1-Electron Beam Evaporation -VST-ODG
- EVS2-Electron Beam Evaporation -Varian (ODG)
- EVS3-Electron Beam Evaporation(SNTG)
- SDS1-Al Sputtering System (MEMS)
- SDS2-Reactive Co-Sputtering System (MEMS)
- SDS3-Reactive Co-Sputtering System (SNTG)
- SDS4-RF Magnetron Sputtering System
- SDS5-Sputtering System
- SDS6-ZnO Sputtering System
- SDS7-MRC (Sputtering System)
- CD1-PECVD (ODG)
- CD2-PECVD_NB(SNTG)
- CD3-PECVD_MB(SNTG)
- CD4-LPCVD_NB(SNTG)
- CD5-LPCVD (MEMS)
- CD6-APCVD_NB(SNTG)
- CD7-MOCVD(ODG)
- DF1-Oxidation diffusion_NB(SNTG)
- DF2-Oxidation_NB(SNTG)
- DF3-Oxidation diffusion_MB(SNTG)
- DF4-Oxidation diffusion(MEMS)
- MA1-Mask Aligner (ODG)
- MA2-Mask Aligner (SNTG)
- MA3-Mask Aligner (MEMS)
- ODG1-Lapping and Polishing
- ODG2-Rapid Thermal Annealing (RTA)
- ODG3-Laser Lift Off
- SNTG1-Critical Point Drier
- SNTG2-Dip PEN Nanowriter
- SNTG3-Mask Making
- SNTG4-Ion Implantation
- HMG1-Via-Punching system
- HMG2-Via-filler
- HMG3-LTCC Screen Printer
- HMG4-Isostatic Laminator
- HMG5-LTCC Box Furnace
- HMG6-Laser micromachining system
- HMG7-HYDE design system
- SDS8-Sputtering System(Gas Sensor)
Characterization Equipments
- ICDG1-AWG with Logic Analyzer
- ICDG2-DSO with Digitizer
- ICDG3-LCR Meter
- ICDG4-Spectrum Analyzer
- MEMS1- Micro system analyzer MSA-500
- MEMS2-DEKTAK 6M Surface Profiler
- MEMS3-Film Stress Measurement System
- MEMS4-IV-CV Characterization System
- MEMS5-Zeta 3D Profiler
- MEMS6-Acoustic Imager
- ODG1-Photoluminescence Mapping System (PL)
- ODG2-Prism Coupler
- ODG3-Hall Effect Measurement System
- ODG4-Step Height Measurement System
- ODG5-Solar Simulator
- ODG6-Intelligent Test System
- ODG7-Thermal Imaging Microscope
- ODG8-Probe Station with EL Spectra
- ODG9-Helium Leak Detector
- ODG10-LED Characterization System
- ODG11-Atomic Force Microscope
- SNTG1-DC Probe Station
- SNTG2-Scanning Electron Microscope with EDS
- SNTG3-Low level IV/CV Measurement System
- SNTG4-Single Wavelength Ellipsometer
- SNTG5-Four Point Probe
- SNTG6-Vibrating Sample Magnetometer
- SNTG7-Nanospec 6100
- SNTG8-FTIR
- FMPG001-Atomic Force Microscope & Raman Spectroscopy
Electron Tubes: Job Cards Status
- MDT01-Furnace(Cathode Group)
- MDT02-Auger Electron Spectroscopy(Cathode Group)
- MTD03-DC Sputter coating system (Cathode Group)
- MDT04-Agilent Vector Network Analyser (VNA)(10 MHz – 50 GHz) (Klystron Group)
- MTD05-RF Peak Power Meter (Klystron Group)
- MTD06-Agilent Spectrum Analyzer 3 Hz- 50 GHz(Klystron Group)
- MTD07-High Voltage Pulse Modulator (Klystron Group)
- MTD08-TIG welder(Klystron Group)
- MTD09-Wellmake Vertical Retort Hydrogen Furnace(Klystron Group)
- MTD10-HHV Vacuum Furnace(Klystron Group)
- MTD11-High Voltage Pulser-I (Magnetron Group)
- MTD12-High Voltage Pulse Modulator II (Magnetron Lab)
- MTD13-Microwave Generator
- MTD14-Vector Network Analyser (VNA) (Magnetron Lab)
- MTD15-Spectrum Analyzer(Magnetron Lab)
- MTD16-PULSE POWER SUPPLY (Plasma Group)
- MTD17-Capacitor Charging power supply(Plasma Group)
- MTD18-RF Power Supply (Plasma Group)
- MTD19-3 Target RF/DC Pulsed Reactive Sputtering System (Plasma Group)
- MTD20-Spectrophotometer(Plasma Group)
- MTD21-Server Machine (Plasma Group)
- MTD22-Semi-Shielded Anechoic chamber (Plasma Group)
- MTD23-ICCD Camera (Plasma Group)
- MTD24-Vacuum Processing Station_(Plasma Group)
- MTD25-Signal Analyzer (TWT)
- MTD26-Magnetizer (TWT)
- MTD27-Signal Generator-N5183A(TWT)
- MTD28-TWT Power Supply (TWT)
- MTD29-Breakdown Tester (30 KV)(ASSEMBLY LAB)
- MTD30-Attn Rod Coating System(TWT)
- MTD31-Vector Network Analyzer(VNA – 220 GHz) (Gyrotron Group)
- MTD32-HHV UHV Processing Station (Dia 2mt x Ht 5 mt)(NFL Hall A)
- MTD33-Crane for Processing Station
- MTD34-LINCOLN TIG welding Machine(Gyrotron Lab)
- MTD35-Beljar hydrogen furnace
- MTD36-120 KV Breakdown Tester (Gyrotron Lab)
- MTD37-Laser Welding(CSF)
- MTD38-Profile projector (OLd Assembly Lab)
- MTD39-HHV -UHV Processing Station(NFL Hall B)
- MTD40-Varian -UHV Processing Station
- MTD41-LEPEL Induction heater(OFL)
- MTD42-Helium Leak Detector (NFL, Hall B)
- MTD43- W-J Muffle furnace 8″ (NFL, Hall B)
- MTD44-HHV-Muffle furnace 8″ (NFL, Hall B)
- MTD45-X-Ray Tomography
- MTD46-BOSS Induction heater
- MTD47-Gas Cylinder Issue Register
- MTD48-Therelek 3″Muffle furnace
- MTD49-W-J 5″ Muffle furnace(OFL)
- MTD50-W-J 3″ Muffle furnace(OFL)
- MTD51-Hydrogen Plant
- MTD52-Water Chillers
- MTD53-Therelek Vertical Furnace(OFL)
- MTD54-W-J Vertical Retort Furnace(OFL)
- MTD55-Chemical Issue Register
- MTD56-Glass blowing system
- MTD57-Sand Blasting Unit (NFL Hall B)