Packaging of ISFET Microsensor (ver. 2)

Packaging of ISFET microsensors was completed using LTCC technology. LTCC substrate with required dimensions was fabricated and screen printing of conductor paste was done as per the mask layout. LTCC frame and lid was also developed for protection of ISFET device. Die bonding and wire bonding of ISFET device were done. Dam & fill technique was used for exposure of sensing layer and encapsulation of remaining part of the device. Packaged ISFET microsensor (Fig. 1) was delivered to a user group of the institute.


Fig. 1: LTCC Packaged ISFET microsensor