Smart Sensors

LTCC Fabrication Facilities

LTCC Design System


Design software with following features:

  • Schematic capture and LTCC layout editor
  • Hybrid resistor and part design
  • Router, DRC and 3D viewer
  • Gerber and drillmill post-processor

Via-punching system

Via-punch system with following features:

  • High speed punching
  • Minimum via dimensions : 100 μm
  • High positional accuracy ~ 5 μm
  • Input file formats : DXF, .nc drill

 Via-filler system

Via-filler system with following features:

  • Based on extrusion technique
  • Vision alignment facility
  • Minimum via hole fill : 100 μm
  • Minimum via fill volume > 90%

High resolution screen printer

Screen printer with following features:

  • Fine line printing capability ~ 200 μm
  • Optical alignment facility
  • Printing speed and snap-off control
  • Large substrate area coverage

Isostatic Laminator

Laminator with following features:

  • High pressure ~ 3000 psi
  • Uniform pressure in all directions
  • Temperature controlled water heating
  • Lamination cycle is carried in water

LTCC Box-Furnace

Box-Furnace with following features:

  • Maximum temperature : 1000 oC
  • Temperature uniformity ~ 2 oC
  • Time-temperature profiler for ramping
  • Precision atmosphere control