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Hybrid Microcircuit Group: Publications and Patents
 
Publications in international/ national journals
Papers in academic conferences
Patents
 
Publications in international/ national journals
 
1.

Khanna P. K., Hornbostel B., Matthias B., Schafer W., and Dorner J. (2005): "Studies on three-dimensional moulding, bonding and assembling of low-temperature-cofired ceramics for MEMS and MST applications", Materials Chemistry and Physics (Elsevier Science, Ireland) 89, 72-79

 
2.

Khanna P. K., Ahmad S., and Grimme R. (2005): "Molecular Weiss domain polarization in piezoceramics to diaphragm, cantilever and channel construction in low-temperature-cofired ceramics for micro-fluidic applications", Materials Chemistry and Physics (Elsevier Science, Ireland) 89, 56-63

 
3.

Khanna P. K., Hornbostel B., Grimme R., Schafer W., and Dorner J. (2004): "Miniature pressure sensor and micromachined actuator structure based on low-temperature-cofired ceramics and piezoelectric material", Materials Chemistry and Physics (Elsevier Science, Ireland) 87, 173-178.

 
4.

Khanna P. K., Hornbostel B., Jager T., and Schafer W. (2004): "MEMS and microsystems based on low-temperature-cofired ceramics: a cost analysis", International Newsletter on Micro-Nano Integration- MST News (VDI/VDE/IT, Germany) 4/04, 40-41.

 
5.

Sommadossi S., Huici J., Khanna P. K., Gust W., and Mittemeijer E. J. (2002), "Mechanical properties of Cu/In-48Sn/Cu diffusion-soldered joints", Zeitschrift fur Metallkunde (Carl Hanser Verlag, Munich, Germany) 93, 496-501.

 
6.

Pandey H. C., Hybrid microcircuits, "IETE Journal of Education, vol.41", pp17-22, July-December 2000 (IETE, India).

 
7.

Sommadossi S., Khanna P. K., Bhatnagar S. K., Litynska L., Zieba P., Gust W., and Mittemeijer E. J. (2000): "Development of Cu/Cu interconnections using an indium interlayer", Microstructural Investigation and Analysis EUROMAT 99 (Wiley- VCH Verlag GmbH, Weinheim, Germany) 4, 214-218.

 
8.

Khanna P. K. , Sommadossi S., Lopez G., Bielanska E., Zieba P., Chang L. S., Gust W., and Mittemeijer E. J. (2000): "Novel Ni/Al/Ni diffusion soldered joints for high temperature applications", Microstructural Investigation and Analysis EUROMAT 99 (Wiley- VCH Verlag, Weinheim, Germany) 4, 219-224.

 
9.

Khanna P. K., Dalke G., and Gust W. (1999): "Morphology and long term stability of Ni/ Ni interconnections based on diffusion soldering, Zeitschrift fur Metallkunde (Carl Hanser Verlag", Munich, Germany) 90, 722-726.

 
10.

Khanna P. K., Bhatnagar S. K., Chang L. S., and Gust W. (1999): "Development, characterization and interface analysis of interconnections based on isothermal solidification process", Zeitschrift fur Metallkunde (Carl Hanser Verlag, Munich, Germany)  90, 470-474.

 
11.

Khanna P. K., Bhatnagar S. K., and Gust W. (1999): "Surface studies of interconnecting zones for selective- area sealing of hybrid microcircuits using isothermal solidification process", Materials Letters (Elsevier Science, Amsterdam, Netherlands) 40, 170-174.

 
12.
Khanna P. K., Bhatnagar S. K., and Gust W. (1999): "Analysis of packaging and sealing techniques for microelectronic modules and recent advances", Microelectronics International (MCB University  Press, West Yorkshire, U.K.) 16, 8-12.
 
13.
Khanna P. K., Bhatnagar S. K., Dalke G., Brunner D., and Gust W. (1995): "Development of thermally stable Ni-Ag interconnections for application to resistive films", Material Science and Engineering 'B' (Elsevier Science Switzerland) 33, L6-L9.
 
14.
Khanna P. K., Bhatnagar S. K., and Gust W. (1994): "Effect of high voltage on the electrical properties and microstructure of thick resistive films", Journal of Material Science & Technology (Bulgarian Academy of Science, Bulgaria) 2, 3-10.
 
15.
Khanna P. K., Bhatnagar S. K., and Gust W. (1994): "Temperature induced physical failure mechanisms in thick resistive films", Materials Letters (Elsevier. Science, Amsterdam, Netherlands) 21, 341-345.
 
16.
Khanna P. K., Bhatnagar S. K., and Gust W. (1994): "On the thermally accelerated ageing of thick film resistor", Physica Status Solidi (a) (Akademie Verlag, Berlin, Germany) 143, K33-K36.
 
17.
Gupta A. K., Kumar Neeraj, Walia D. K., Tomar V. S., Ojha V. N., Pandey H. C., Bhatnagar S. K., Jain Y. K., (1990): "Laser patterning of microbridges and the dc SQUID structure on Bi-Sr-Ca-O film", Superconducting science and technology, 3, 191.
 
18.
Gupta A. K., Kumar Neeraj, Walia D. K., Tomar V. S., Ojha V. N., Pandey H. C., Bhatnagar S.K., Jain Y.K., (1990): "Quantum interference effects in laser patterned BSCCO thick-film", Pramana J. of Physics 35.
 
19.
Pandey H. C., Jain Y. K., Bhatnagar S. K., Singh B. R. (1988): "Direct laser beam writing on Y-BaCuO film for superconducting microelectronic devices", Japanese Journal of Applied Physics (JJAP, Japan) 27, L1517-1520.
 
20.
Khanna P. K., Bhatnagar S. K., and Sisodia M. L. (1988): "Interdiffusion phenomena and electrical conduction in thick film segmented resistor structures", Journal of Physics 'D': Applied Physics (IOP, Bristol, U.K.) 21, 1796–801.
 
21.
Khanna P. K., Bhatnagar S. K., and Sisodia M. L. (1987): "On the TCR and electrical conduction in a thick film segmented resistor structure", Physica Status Solidi  (a) (Akademie Verlag, Berlin, Germany) 103, K17-K21.
 
22.
Khanna P. K., Bhatnagar S. K., and Sisodia M. L. (1987): "Development of a thick film tunable RC-active filter using segmented resistors", International Journal of Electronics (Taylor & Francis, London, U.K.) 633, 1-8.
 
23.
Khanna P. K., Bhatnagar S. K., and Sisodia M. L. (1987): "Interactions between thick-resistive films and design criteria for segmented resistors", Journal of Physics 'D': Applied Physics (IOP, Bristol, U.K.) 20, 664–666.
 
24.
Khanna P. K. and Bhatnagar S. K. (1987): "A thick film segmented resistor structure for high trimfactors, Active and Passive Electronic Components", (Gordon and Breach, U.K.) 12, 187-190.
 
25.
Pandey J. D., Pandey H. C. and Saran D. R.: "Compressional wave attenuation along the <111> Direction in some noble metals", Acoustic Letters (UK), 3, 70 (1979).
 
26.
Pandey J. D. Pandey H. C. and Chaturvedi C. V.: "Study of effective Debye temperature for a pure and doped semiconductor (GaSb)", Curr. Sci. 48,1 (1979).
 
27.
Pandey H. C. and Pandey J. D.: "Thermodynamic Non-linearity Parameters of Castor oil",  Acoustic Letters (UK), Vol. 3, No. 1, 1979).
 
28.
Pandey H. C. and Pandey J. D.: "Temperature dependence of Non-linearity constant and ultrasonic attenuation in germanium", J. Appl. Phys. (America) 49, 205 (1978).
 
29.
Pandey H. C. and Pandey J. D.: "Temperature and pressure dependence of effective Debye temperature for NaCl", Ind. J. Pure and Appl. Phys. 15 443 (1977).
 
30.
Pandey H.C. and Pandey J.D.: "Ultrasonic attenuation in single crystal nickel at 298 K and 80 K", Ind. J. Phys. 51A, 36 (1977).
 
31.
Pandey H. C. and Pandey J. D.: "Temperature and pressure dependence of thermodynamic and related parameters of castor oil", Acta Chimica (Hungary) 91(3), 243 (1976).
 
32.
Pandey H. C., Bhatt Miss. T. and Pandey J. D.: "Acoustical parameters of liquid H2S, CO, CD4, HCN, C2N2 and POCl3 in relation to significant structure theory", Acustica Vol. 35, 274 (76).
 
33.
Pandey H. C. and Pandey J. D. : "The study of Debye temperature for liquid argon Acustica", 34, 243 (1976).
 
34.
Pandey J. D. and Pandey H. C.: "Temperature and pressure dependence of Non‑linearity acoustic parameters (B/A) and (C/A) for liquid mercury", Acustica 35, 283 (1976).
 
35.
Pandey H. C., Thakur R. P. and Pandey J. D.: "Anharmonicity of alkali halide Crystal", Proc. Nat. Acad. Sci. 45A, IV 250 (1975).
 
36.
Pandey J. D. and Pandey H. C.: "Temperature dependence of pseudo Gruneisen Parameters for liquids", Acustica, 34, 115 (1975).
 
37.

Pandey H. C. and Pandey J. D.: "The study of ultrasonic scattering through Non‑ linearity Parameter", Ind. J. Phys. 49, 866 (1975).

 
38.
Pandey H. C. Jain R. P., and Pandey J. D.: "Temperature and pressure dependence of free volume and intermolecular free length, Acustica", 34, 123 (1975).
 
39.
Pandey J. D. and Pandey H. C.: "Effective Debye temperature and specific heat ratio in liquid methane and pentane", Ind. J. Phys. 49, 869 (1975).
 
40.
Pandey H. C. and Pandey J. D.: "Compressional study of higher alkanes through pseudo Gruneisen Parameters", Physica Status Solidi, (b) 65, K149 (1974).
 
Papers in academic conferences
 
1.

Singh Amanpal, Jain Supriya, Khanna P. K., Kumar Nitin, Sadistap S. S., Jain Y. K, Pandey H. C., Kumar S., Sharma I. C.: "Development of a touch-free temperature indicator for specific applications", National Systems Conf., Manipal, Dec. 2007 (NSC, India).

 
2.
Madhana M, Somayajula Bhaskar, Khanna P. K., Pandey H. C., Jain Y. K., Kumar S., Sharma I. C.: "Design and process evolution for development of multilayer ceramic feed-through package using low temperature co-fired ceramic technology for cryogenic micro-sensor applications, National Conference on MEMS, Microsensors, Smart Materials, Structures and Systems", CEERI, Pilani, Nov. 16-17, 2007 (ISSS, India).
 
3.
Clair A. S., Khanna P. K.: "Development of ZnO substrates and a conceptual integrated microsystem approach", Proceedings of the National Conference on Information Technology: Emerging Engineering Perspectives & Practices, Thapar University, Patiala, India, April, 2007,123-127 (ITEEPP, India).
 
4.
Jain Y. K., Pandey H. C., Kumar Sunil, Sharma I. C., Bhaduria Avanish, Kumar Lokesh, Khanna P. K., Bhargava J. K., Sharma A. K.: "Development of microwave components in low-temperature co-fireable ceramic (LTCC)", IINC on Advances in Micro-Nano Electronic Materials, Technologies, Devices and Systems, Bangalore, India, Dec., 2006 (IMAPS, India).
 
5.
Khanna P. K., Jain Y. K., Pandey H. C., Kumar Nitin, Kumar Sunil, Sharma I. C.: "Investigations of high temperature stable bonding materials for transparent applications", IMS Conference, Kurukshetra, India, 2006, 32 (IMS, India).
 
6.
Jain Y. K., Pandey H. C., Khanna P. K., Prasad D., Gupta S. K., Sharma I. C., Pathak H. C., Kumar Nitin and Sharma Anurag: "Development of thick film Pt heater for sensor applications", IINC on Microelectronics and VLSI, Mumbai, India, Dec.,2005 (IMAPS, India).
 
7.
Tobail O., Khanna P. K., Rostan J., Brenner K, Schubert M. B., Werner J. H.: "Integrated photovoltaic mini-modules of thin-film monocrystalline Si solar cells", Proc. 2nd International Conference on Advances in Engineering Sciences and Technologies, 2005, 96 (Cairo).
 
8.
Ram Teja, Srivastav N., Pandey H. C., Jain Y. K., Dwivedi H. K. and Singh B. R.: "Performance of laser patterned metal-alumina-metal planar microdischarge arrays", NCOMT, Chandigarh, India, 2004, ( India).
 
9.
Jain Y. K., Pandey H. C., Prasad D., Kumar S., Sharma I. C. and Ahmad S.: "Development of packaging technology for ISFET biosensors", NCOMT, Chandigarh, India, 2004, (India).
 
10.
Jain Y. K., Pandey H.C., Prasad D., Kumar S. and Sharma I. C.: "Development of LTCC technology at CEERI- A future packaging technology", IINC, Bangalore, India, 2004, (IMAPS, India).
 
11.
Pandey H. C., Prasad D., Kumar S., Sharma I. C., and Jain Y. K.: "Laser assisted LTCC process for MCM and MEMS devices", IINC, Bangalore, India, 2004, (IMAPS, India).
 
12.
Jain Y. K., Pandey H. C., Bhatnagar S. K., Khanna P. K., Prasad D., and Sharma N. L.: "A novel and low cost copper conductor for power thick film hybrid microcircuits, Proceedings of the 3rd International conference on Emerging Microelectronics and Interconnection Technologies", Bangalore, India, 2000, TP-6 2.1-TP-6 2.6 (IMAPS, India).
 
13.
Pandey H. C., Jain Y. K., Bhatnagar S. K., Khanna P. K., Kripesh V., Mathur D., and Prasad D.: "Development of miniaturised resistors using an unique design methodology and blending of resistor pastes, Proceedings of the 3rd International conference on Emerging Microelectronics and Interconnection Technologies", Bangalore, India, 2000, TP-6 5.1-TP-6 5.6 (IMAPS, India).
 
14.
Khanna P. K., Bhatnagar S. K., Sommadossi S., Gust W., and Mittemeijer E. J.: "Development of a novel Si/Si interconnection technology for high density packaging, [Conference Paper] SPIE-Int. Soc. Opt. Eng. Proceedings of Spie-the International Society for Optical Engineering", 3906, 149-153. USA.
 
15.
Jain Y. K., Bhatnagar S. K., Pandey H. C., Khanna P. K., Kripesh V., and Mathur D.: "Development of  technology for automotive power hybrid microcircuits, Proceedings of the 2nd  International conference on Emerging Microelectronics and Interconnection Technologies", Bangalore, India, 1998, 438-443 (IMAPS, India).
 
16.
Pandey H. C., Bhatnagar S. K., Jain Y. K., Khanna P. K., Kripesh V., and Mathur D.: "Development of one mil technology for thick film using laser micro machining, Proceedings of the 2nd International conference on Emerging Microelectronics and Interconnection Technologies", Bangalore, India, 1998, 432-437 (IMAPS, India).
 
17.
Mathur D., Khanna P. K., Jain Y. K., Pandey H. C., Bhatnagar S. K., and Kripesh V.: "A simplified approach to failure rate analysis of high density hybrid microcircuits, Proceedings of the 2nd International conference on Emerging Microelectronics and Interconnection Technologies", Bangalore, India, 1998, 275-279 (IMAPS, India).
 
18.
Jain Y. K., Bhatnagar S. K., Pandey H. C., Khanna P. K., and Kripesh V.: "Via-terminating-resistor (VTR) structure with reduced dimensions", Presentation at the ISHM Annual Conference, Bangalore, India, 1992 and published in Hybrid Microelectronics, 3, 6-11 (ISHM, India).
 
19.
Kripesh V., Bhatnagar S. K., Khanna P. K., Jain Y. K., and Pandey H. C.: "Implementation of VLSI CAD tools for designing multichip hybrid modules", Presentation at the ISHM Annual Conference, Bangalore, India, 1992 and published in Hybrid Microelectronics, 3, 33-36 (ISHM, India).
 
20.
Pandey H. C., Singh R. N., Bhatnagar S. K., Jain Y. K., and Khanna P. K.:"Functional trimming of RC-active filters: a simple novel approach", Proceedings of the 6th ISHM Annual Conference, Bangalore, India, 1991, 2.8-2.12 (ISHM, India).
 
21.
Pandey H. C., Bhatnagar S. K., Kothari H. S., and Singh B. R.,"The application of Nd-YAG Laser for  ablation and pattering of High Tc Superconductor Thinfilm", Paper presented at Vth Annual Conference ISHM, INDIA 90 held at New Delhi, India, 1990 and and published in HYBRID MICRO, 1, 18 (1990), (ISHM, India).
 
22.
Jain Y. K., Khanna P. K., and Bhatnagar T. N.:"Current noise in via-terminating-resistors", Presentation at the ISHM Annual Conference, New Delhi, India, 1990 and published in Hybrid Microelectronics, 1, 26-28 (ISHM, India).
 
23.
Jain Y. K., Pandey H. C., Bhatnagar S. K. and Khokle W. S.: "On refiring of via-terminating resistor (VTR) structure", Presentation at ISHM, Europe, Hamburg, Germany, 1989 (ISHM, Europe).
 
24.
Jain Y. K., Pandey H. C., Bhatnagar S. K. and Khokle W. S.: "HMC using VTR and LCC for high reliability applications", Presentation at ISHM Annual Conference, Pune, India, 1988 (ISHM, India).
 
25.
Bhatnagar S. K., Jain Y. K., Pandey H. C. and Khokle W. S.: "Present status of hybrid circuits technology at CEERI", Presentation at Seminar ITI, Mankapur, India, 1988 (India).
 
26.
Jain Y. K., Pandey H. C., Bhatnagar S. K. and Khokle W. S.: "Via-terminating resistor: a new thick-film structure", Presentation at the ISHM Annual Conference, Hyderabad, India, 1988 (ISHM, India).
 
27.
Jain Y. K., Pandey H. C, Bhatnagar S. K., and Khokle W. S.: "Development of hybrid microcircuits for AC motor drives", National seminar on AC motor drives, Pilani, India, 1987 (India).
 
28.
Khanna P. K. and Bhatnagar S. K.: "Performance characteristics of a thick film segmented resistor structure", Proceedings of the 4th International Microelectronics Conference, Kobe, Japan, 1986, 497–503 (ISHM, Japan).
 
Patents
 
1.
Bhatnagar S. K., Gust W., Khanna P. K., Mittemeijer E. J., and Sommadossi S. (2002): "A process for diffusion soldering", Patent No. 354/DEL/02 (India).
 
2.
Bhatnagar S. K., Gust W., Khanna P. K., Mittemeijer E. J., and Sommadossi S. (2002): "A novel metallic paste composition useful as an interlayer in diffusion soldering", Patent No. 355/DEL/02 (India).
 
3.
Jain Y. K., Pandey H. C. and Bhatnagar S. K. (2000): "A process for fabrication of improved metallised ceramic substrate", Patent No. 160/DEL/2000 (India).
 
4.
Jain Y. K. and Pandey H. C.(1997): "Process for the fabrication of improved conductor for power thick-film hybrid microcircuits/ microwave integrated circuits", Patent No. 2449/DEL/97 (India).
 
5.
Khanna P. K. and Bhatnagar S. K (1997): "A process for joining metal-to-thick-film composite system on insulating substrate", Patent No. 3347/DEL/97 dated 26.11.1997 (India).
 
6.
Jain Y. K., Bhatnagar S. K. and Pandey H. C., "A Process for formation of stencil for solder cream printing on thick film Hybrid" Circuits No. 633. Del/87, 1987.
 

   
 
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